About Leatec

History

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Year Major events
2007 Earned ISO/TS 16949:2002 accreditation which is the international recognition of quality authentication.
2006 China’s Kunshan plant earned ISO14001 accreditation which is the international recognition of environmental quality.
2005 Expansion to car-used electronic material field.
2003 Trans-investment in the merger of Cosmos Harvest International Limited and Wisetrade Corporation in which Cosmos Harvest International Limited is the acquiring company.
Expansion to LED package substrates.
2002 Stock listing on the OTC market as from January 10.
Trans-investment in LEATEC Fine Ceramics (Kunshan) Co., Ltd. to start mass production of alumina chip resistor substrates.
Establishment of Shin Wo Plant to manufacture LTCC package substrates.
China’s Kunshan plant earned ISO9001: 2000 accreditations which is the international recognition of quality.
2001 Trans-investment in China Development Industrial Bank.
Trans-investment in Cosmos Harvest International Limited.
Trans-investment in Wisetrade Corporation.
Gre Tai Securities Market approved stock listing of the company on the OTC market.
2000 Trans-investment in LEATEC Fine Ceramics (Kunshan) Co., Ltd.
Trans-investment in LEATEC Fine Ceramics (Samoa) Co., Ltd.
1999 Mass production of laser process substrates.
1998 Development of ZrO2 solid fuel electrolyte substrates.
1997 Mass production of 96% alumina chip array substrates.
Development of ZrO2, microwave, porous and High K ceramic substrate.
1996 Development of 96% alumina chip array substrates.
Earned ISO-9002 accreditation which is the international recognition of quality.
1995 Expansion of production line, and development of 96% alumina chip resistor substrates.
1993 Launch of mass production of 96% alumina ceramic substrates (resistor network substrates, thick film substrates, and variable resistor substrates) .
1991 As approved by the competent authorities, the company was established on December 2 with registered.