About Leatec

History

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Year Major events
2007 Earned ISO/TS 16949:2002 accreditation which is the international recognition of quality authentication.
2006 China’s Kunshan plant earned ISO14001 accreditation which is the international recognition of environmental quality.
Change of the total paid-in capitalization to be NT$811.47551 million.
2005 Expansion to car-used electronic material field.
2003 Capital increase by transferring convertible bonds common stock which made the total paid-in capitalization to be NT$791.67537 million.
Trans-investment in the merger of Cosmos Harvest International Limited and Wisetrade Corporation in which Cosmos Harvest International Limited is the acquiring company.
Expansion to LED package substrates.
2002 Stock listing on the OTC market as from January 10.
Capital increase which made the total paid-in capital to be NT$748.86 million and registered capitalization to be NT$1,170 million.
Trans-investment in LEATEC Fine Ceramics (Kunshan) Co., Ltd. to start mass production of alumina chip resistor substrates.
Issue of 1st local secured and 2nd local unsecured convertible bonds with the amount of NT$20 million and NT$16 million respectively.
Establishment of Shin Wo Plant to manufacture LTCC package substrates.
China’s Kunshan plant earned ISO9001: 2000 accreditations which is the international recognition of quality.
2001 Trans-investment in China Development Industrial Bank.
Trans-investment in Cosmos Harvest International Limited.
Trans-investment in Wisetrade Corporation.
Capital increase by earnings recapitalization which made the total paid-in capitalization t to be NT$624.86 million and registered capitalization to be NT$900 billion.
Gre Tai Securities Market approved stock listing of the company on the OTC market.
2000 Capital increase which made the total paid-in capitalization to be NT$471 million.
Trans-investment in LEATEC Fine Ceramics (Samoa) Co., Ltd.
1999 Capital increase by earnings recapitalization which made the total paid-in capitalization to be NT$336.8948 million.
Mass production of laser process substrates.
1998 Development of ZrO2 solid fuel electrolyte substrates.
1997 Mass production of 96% alumina chip array substrates.
Development of ZrO2, microwave, porous and High K ceramic substrate.
1996 Development of 96% alumina chip array substrates.
Capital increase by cash and transfer of capital surplus to common stock which made the total paid-in capitalization to be 306.258 million.
Earned ISO-9002 accreditation which is the international recognition of quality.
1995 Expansion of production line, and development of 96% alumina chip resistor substrates.
Transfer of surplus to common stock and capital increase by cash which made the total paid-in capitalization to be NT$186.32 million.
Capital increase by cash which made the total paid-in capitalization to be NT$266.32 million and registered capitalization to be NT$50 million.
1994 NT$36 million of capital increase by cash which made the total paid-in capitalization to be NT$136 million.
1993 Launch of mass production of 96% alumina ceramic substrates (resistor network substrates, thick film substrates, and variable resistor substrates) .
NT$20 million of capital increase by cash which made the registered and total paid-in capitalization to be NT$100 million.
1992 NT$20 million of capital increase by cash which made the total paid-in capitalization to be NT$40 million.
NT$27.75 million of capital increase by cash and using NT$12.25 million of credit’s rights for stock payment which made the total paid-in capitalization to be NT$80 million .
1991 As approved by the competent authorities, the company was established on December 2 with registered capitalization of NT$80 million in which the paid-in capitalization was NT$20 million.