Year | Major events |
---|---|
2007 | Earned ISO/TS 16949:2002 accreditation which is the international recognition of quality authentication. |
2006 | China’s Kunshan plant earned ISO14001 accreditation which is the international recognition of environmental quality. |
Change of the total paid-in capitalization to be NT$811.47551 million. | |
2005 | Expansion to car-used electronic material field. |
2003 | Capital increase by transferring convertible bonds common stock which made the total paid-in capitalization to be NT$791.67537 million. |
Trans-investment in the merger of Cosmos Harvest International Limited and Wisetrade Corporation in which Cosmos Harvest International Limited is the acquiring company. | |
Expansion to LED package substrates. | |
2002 | Stock listing on the OTC market as from January 10. |
Capital increase which made the total paid-in capital to be NT$748.86 million and registered capitalization to be NT$1,170 million. | |
Trans-investment in LEATEC Fine Ceramics (Kunshan) Co., Ltd. to start mass production of alumina chip resistor substrates. | |
Issue of 1st local secured and 2nd local unsecured convertible bonds with the amount of NT$20 million and NT$16 million respectively. | |
Establishment of Shin Wo Plant to manufacture LTCC package substrates. | |
China’s Kunshan plant earned ISO9001: 2000 accreditations which is the international recognition of quality. | |
2001 | Trans-investment in China Development Industrial Bank. |
Trans-investment in Cosmos Harvest International Limited. | |
Trans-investment in Wisetrade Corporation. | |
Capital increase by earnings recapitalization which made the total paid-in capitalization t to be NT$624.86 million and registered capitalization to be NT$900 billion. | |
Gre Tai Securities Market approved stock listing of the company on the OTC market. | |
2000 | Capital increase which made the total paid-in capitalization to be NT$471 million. |
Trans-investment in LEATEC Fine Ceramics (Samoa) Co., Ltd. | |
1999 | Capital increase by earnings recapitalization which made the total paid-in capitalization to be NT$336.8948 million. |
Mass production of laser process substrates. | |
1998 | Development of ZrO2 solid fuel electrolyte substrates. |
1997 | Mass production of 96% alumina chip array substrates. |
Development of ZrO2, microwave, porous and High K ceramic substrate. | |
1996 | Development of 96% alumina chip array substrates. |
Capital increase by cash and transfer of capital surplus to common stock which made the total paid-in capitalization to be 306.258 million. | |
Earned ISO-9002 accreditation which is the international recognition of quality. | |
1995 | Expansion of production line, and development of 96% alumina chip resistor substrates. |
Transfer of surplus to common stock and capital increase by cash which made the total paid-in capitalization to be NT$186.32 million. | |
Capital increase by cash which made the total paid-in capitalization to be NT$266.32 million and registered capitalization to be NT$50 million. | |
1994 | NT$36 million of capital increase by cash which made the total paid-in capitalization to be NT$136 million. |
1993 | Launch of mass production of 96% alumina ceramic substrates (resistor network substrates, thick film substrates, and variable resistor substrates) . |
NT$20 million of capital increase by cash which made the registered and total paid-in capitalization to be NT$100 million. | |
1992 | NT$20 million of capital increase by cash which made the total paid-in capitalization to be NT$40 million. |
NT$27.75 million of capital increase by cash and using NT$12.25 million of credit’s rights for stock payment which made the total paid-in capitalization to be NT$80 million . | |
1991 | As approved by the competent authorities, the company was established on December 2 with registered capitalization of NT$80 million in which the paid-in capitalization was NT$20 million. |