Laser Machining Ceramic Substrate

Leatec have excellent laser service for Al2O3, ALN substrate.

Laser Processing Service for Ceramic substrate:

1.Laser Cutting, Scribing, and Drilling service for ceramic substrate.
2.Leatec provide the design, laser express and surface treatment consultation service.
3.Customization is available.

For Laser Scribing

Cross Section slag not eliminated slag eliminated
Laser pulse depth Laser depth tolerance Laser spot size Laser spot pitch Substrate slag height
0.1mm ±0.05mm 0.100±0.01mm 0.127±0.015 mm T2-T1<0.015mm
0.2mm 0.125±0.01mm 0.152±0.015 mm
0.3mm 0.145±0.01mm
0.4mm ±0.078mm 0.165±0.01mm 0.178±0.015 mm
0.5mm 0.175±0.01mm

For Laser Drilling and Cutting

Min drilling diameter ψ0.10mm
Roundness <0.05mm
Hole taper D-d<10%A
Max Drilling thickness 1.0mm
Laser scribing gap 0.100±0.015mm
Hole taper

For Cross-Point Technology

Cross point 103× Cross point 103×
Substrate size size
tolerance
Vertical
precision
Pitch opposite
precision
Pitch
accumulated
tolerance
Pitch resolution
unit
170 mm x 170 mm ±0.03㎜ 90°±20” ±0.010㎜ ±0.015㎜ 0.001㎜