Hybrid Substrate for LED Carrier:
 

LED possesses characteristics of tiny size, high thermal shock resistance, high efficiency of luminosity and low power consumption, thus can be applied  to visible light and invisible LED light (infrared rays). With respect to visible LED light, it applies to mobile phone, PDA, digital camera, traffic signal light, LCD backlight and green energy resources. Further, the neon lamp is expected to be replaced by newly-developed light bar. As for invisible LED light, it applies to  remote controller of home appliances, high-quality stereo transmission, OA equipments, PC mouse, fire sensor, CO detector and infrared rays of express way tolling system etc..

HIC LED carrier developed by LEATEC processes high thermal dissipation and gas-tight characteristics, and thus could provide LED luminosity efficiency and long lifetime. Further its gas-tight characteristics enables harsh environment applications, especially for traffic light signal, outdoor display board, auxiliary illumination and main lighting etc., all of which can use HIC LED substrate to achieve best performance!

 

Characteristic of HIC LED Carrie:
 

Item Unit 氧化鋁Al2O3 氮化鋁AlN

Sintered density

g/cm3

3.72

3.3

Flexural strength

Mpa

350

450

Young's Modulus

Gpa

--

320

Thermal expansion coefficient

-1

8×10-6

5.0×10-6

Dielectric strength

kV/mm

>14

>14

Dielectric constant

(1MHz)

9.5

8.7

Volume Resistivity

Ω.cm

>1014

>1014

Thermal conductivity

W/m.K

22.3

180

 

The presented value are typical material properties and were determined for test samples and follow testing standard. It may vary according to production configuration and manufacturing process. It do not a guarantee for certain properties. Leatec reserve the right to make technical changes.

 

Design Rules for LED Carrier:
 

 

Item

Standard
 min.(Unit:μm)

 Premium

 min.(Unit:μm)

 1

Via diameter

 200

 150

 2

Via pin pitch

 400

 250

 3

Line width

 200

 150

 4

Line spacing

 200

 150

 5

Clearance via hole

 200

 150

 6

Clearance between pattern edge
and substrate edge

 300

 150

 

LED Substrate Introduction:
 

 

 

 

Product profile & material performance list:
 

Specification

Substrate 

Material

Conductive 

Layer

Reflector Electrode Type 

Al2O3

AlN

Ag

Au

Material 

Angel

Two

Multi

Thermal

-Electric 

Separation

Al2O3

Vertical

Taper

4732

V

V

V

V

 

 

 

V

 

 

5050

V

V

V

V

V

V

V

 

V

V

7090

V

V

V

V

V

V

V

V

 

 

3535

V

 

V

V

 

V

 

V

 

V

1010

V

V

V

V

 

V

 

 

V

V

1212

V

V

V

V

 

V

 

V

 

V

 

 

Typical material characteristics of ceramic substrate:
 

Type Unit 96%Al2O3 AlN

Color

-

White

Gray

Bulk Density

g /cm3

3.72

3.30

Bending Strength

MPa

350

450

Coefficient of Thermal Expansion

×10-6/℃ RT~800℃

8.0

5.0

Water Absorption

%

0

0

Thermal Conductivity

W/m.K

22

180

 

 

Products Specification and Dimension Parameter:

 

LH002A03535C0000–Array of sheet:10 × 24= 240 pcs

 

   

 

 

LH002A05050C0000–Array of sheet:8 × 18= 144 pcs

 

   

 

 

LH002A04732C0000–Array of sheet:10 × 12= 120 pcs

 

   

 

 

LH002A27090C0000–Array of sheet:6 × 10= 60 pcs

 

   

 

 

LH004A11010C0000–Array of sheet:4 × 9 = 36 pcs

 

   

 

LH004A01212C0000–Array of sheet:2 × 5 = 10 pcs

   

 

Thick film printing design guideline:
 

Item Unit Specification
Conductor Material - Ag
Resistance mΩ/□ 3
Adhesive strength Tape peeling test No visual defect
Line Width μm

Standard - Min. 125

Premium - Min. 100

Line Spacing μm

Standard - Min. 125

Premium - Min. 100

Thickness μm Min. 5
Flatness μm Standard - Max. 7
Premium - Max. 3

 

Typical surface profile of conductor sheet:

Standard

Premium