Laser Machining Ceramic Substrate

Leatec have excellent laser service for Al2O3, ALN substrate.

Laser Processing Service for Ceramic substrate：

1.Laser Cutting, Scribing, and Drilling service for ceramic substrate.
2.Leatec provide the design, laser express and surface treatment consultation service.
3.Customization is available.

For Laser Scribing

Cross Section	slag not eliminated	slag eliminated

Laser pulse depth	Laser depth tolerance	Laser spot size	Laser spot pitch	Substrate slag height
0.1mm	±0.05mm	0.100±0.01mm	0.127±0.015 mm	T2-T1＜0.015mm
0.2mm		0.125±0.01mm	0.152±0.015 mm
0.3mm		0.145±0.01mm
0.4mm	±0.078mm	0.165±0.01mm	0.178±0.015 mm
0.5mm		0.175±0.01mm

For Laser Drilling and Cutting

Min drilling diameter	ψ0.10mm
Roundness	<0.05mm
Hole taper	D-d<10%A
Max Drilling thickness	1.0mm
Laser scribing gap	0.100±0.015mm

Hole taper

For Cross-Point Technology

Cross point 103×	Cross point 103×