About Leatec

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Year Major events
2022 Leatec Fine Ceramics (Kunshan) Co., Ltd. started the relocation process to the new factory site of Leatec Applied Materials (Kunshan) Co., Ltd. in July.
Issued secured corporate bonds with a total amount of NT$250 million due in December 2023.
2021 The Company's board of directors underwent a comprehensive election and established an audit committee.
Leatec Fine Ceramics (Kunshan) Co., Ltd. signed a house demolition and compensation contract with the Company due to government construction needs.
2019 LEATEC Fine Ceramics (Kunshan) Co., Ltd. obtained IATF16949 certification.
LEATEC Fine Ceramics Co., Ltd. obtained ISO45001 certification and CNS45001 inspection certificate.
2018 LEATEC Fine Ceramics Co., Ltd. obtained the IATF16949 certification.
2017 LEATEC Fine Ceramics Co., Ltd. obtained ISO14001 certification.
2016 The Institute of Nuclear Energy Research of the Atomic Energy Council, Executive Yuan authorized the “Solid Oxide Fuel Cell - Cell Stack Technology”.
2014 LEATEC Fine Ceramics (Kunshan) Co., Ltd. was certified as a "Jiangsu High and New Tech Enterprise" in 2014.
2013 The Institute of Nuclear Energy Research of the Atomic Energy Council, Executive Yuan authorized the “Solid Oxide Fuel Cell Ceramic Substrate Supported Unit Cell Manufacturing Technology”.
Invested in the production of aluminum nitride (ALN) ceramic substrates.
The investee LEATEC Applied Materials (Kunshan) Co., Ltd. was established, located in Kunshan High-Tech Industrial Development Zone.
2011 Invested in ECOCERA Optronics Co., LTD..
LEATEC Fine Ceramics (Kunshan) Co., Ltd. was awarded the highest grade "Green" in the Kunshan City Industrial Enterprise Environmental Behavior Rating in 2010.
LEATEC Fine Ceramics (Kunshan) Co., Ltd. was certified as a "Jiangsu High and New Tech Enterprise" in 2011.
LEATEC Fine Ceramics Co., Ltd. was certified as an “operational headquarters” by the Industrial Development Bureau, Ministry of Economic Affairs.
2010 LEATEC Fine Ceramics (Kunshan) Co., Ltd. obtained both “Kunshan City R&D Organization Certification” and “Suzhou City R&D Organization Certification”.
2008 Crossed over the field solar photovoltaic products.
LEATEC Fine Ceramics Co., Ltd. obtained the "CG6004 General Corporate Governance System Certification" from the Taiwan Corporate Governance Association.
2007 Earned ISO/TS 16949:2002 accreditation which is the international recognition of quality authentication.
2006 China’s Kunshan plant earned ISO14001 accreditation which is the international recognition of environmental quality.
2005 Expansion to car-used electronic material field.
2003 Trans-investment in the merger of Cosmos Harvest International Limited and Wisetrade Corporation in which Cosmos Harvest International Limited is the acquiring company.
Expansion to LED package substrates.
2002 Stock listing on the OTC market as from January 10.
Trans-investment in LEATEC Fine Ceramics (Kunshan) Co., Ltd. to start mass production of alumina chip resistor substrates.
Establishment of Shin Wo Plant to manufacture LTCC package substrates.
China’s Kunshan plant earned ISO9001: 2000 accreditations which is the international recognition of quality.
2001 Trans-investment in China Development Industrial Bank.
Trans-investment in Cosmos Harvest International Limited.
Trans-investment in Wisetrade Corporation.
Gre Tai Securities Market approved stock listing of the company on the OTC market.
2000 Trans-investment in LEATEC Fine Ceramics (Kunshan) Co., Ltd.
Trans-investment in LEATEC Fine Ceramics (Samoa) Co., Ltd.
1999 Mass production of laser process substrates.
1998 Development of ZrO2 solid fuel electrolyte substrates.
1997 Mass production of 96% alumina chip array substrates.
Development of ZrO2, microwave, porous and High K ceramic substrate.
1996 Development of 96% alumina chip array substrates.
Earned ISO-9002 accreditation which is the international recognition of quality.
1995 Expansion of production line, and development of 96% alumina chip resistor substrates.
1993 Launch of mass production of 96% alumina ceramic substrates (resistor network substrates, thick film substrates, and variable resistor substrates) .
1991 As approved by the competent authorities, the company was established on December 2 with registered.

　

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